BS EN 60191-2 F68. Mechanical standardization of semiconductor devices. Part 2. Dimensions
BS EN 60191-2 F68 半导体器件的机械标准化 第二部分 尺寸

2010-11-23

BS EN 60191-2 F69. Mechanical standardization of semiconductor devices. Part 2. Dimensions
BS EN 60191-2 F69 半导体器件的机械标准化 第二部分 尺寸

2010-11-23

BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
英国标准EN 60191-6 半导体器件的机械标准化 第六部分 表面安装半导体器件封装外形图绘制通则

2007-06-25

BS EN 60191-6-19. Mechanical standardization of semiconductor devices. Part 6-19. Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
英国标准EN 60191-6-19 半导体器件的机械标准化 第6-19部分 包装高温翘曲和最大允许翘曲的测量方法

2008-01-03

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
半导体器件的机械标准化.第6-16部分:BGA LGA FBGA和FLGA用半导体试验和老化插座术语表（IEC 60191-6-16-2007）；德文版EN 60191-6-16:2007

2007-11-01

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
半导体器件的机械标准化第6-22部分:表面安装半导体器件封装外形图绘制的一般规则半导体封装的设计指南硅细间距球栅阵列和硅细间距地栅阵列（S-FBGA和S-FL

2013-08-01

BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
英国标准EN 60191-6-1 半导体器件的机械标准化 第6-1部分 表面安装半导体器件封装外形图绘制的一般规则 鸥翼引线端子设计指南

2010-05-06

BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
英国标准EN 60191-6-18 半导体器件的机械标准化 第6-18部分 表面安装半导体器件封装外形图绘制的一般规则 球栅阵列（BGA）设计指南

2008-01-03

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸（IEC 60191-6-10-2003）；德文版EN 60191-6-10:2003

2004-05-01

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
半导体器件的机械标准化.第6-6部分:表面安装半导体器件封装外形图绘制的一般规则；细间距地栅阵列（FLGA）的设计指南（IEC 60191-6-6-2001）；德文版本EN 60191-6-6:2001

2002-02-01

BS EN 60191-6-5. Mechanical standardization of semiconductor devices. Part 6-5. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch ball grid array (FBGA)
英国标准EN 60191-6-5 半导体器件的机械标准化 第6-5部分 表面安装半导体器件封装外形图绘制的一般规则 细间距球栅阵列（FBGA）设计指南

2009-10-26

BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化 第6-21部分 表面安装半导体器件封装外形图绘制的一般规则 小外形包装的包装尺寸测量方法（SOP）

2008-12-01

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
半导体器件的机械标准化.第6-19部分:高温下封装翘曲和最大允许翘曲的测量方法（IEC 60191-6-19-2010）；德文版EN 60191-6-19:2010

2010-10-01

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则；鸥翼引线端子设计指南（IEC 60191-6-1-2001）；德文版EN 60191-6-1:2001

2002-08-01

IEC 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
IEC 60191-6-16 半导体器件的机械标准化 第6-16部分 BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2005-04-27

BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
英国标准EN 60191-6-20 半导体器件的机械标准化 第6-20部分 表面安装半导体器件封装外形图绘制的一般规则 小外形J形引线封装（SOJ）的封装尺寸测量方法

2008-12-01

BS EN 60191-6-12. Mechanical standardization of semiconductor devices. Part 6-12. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type
英国标准EN 60191-6-12 半导体器件的机械标准化 第6-12部分 表面安装半导体器件封装外形图绘制的一般规则 细间距陆地栅格阵列（FLGA）设计指南 矩形

2010-01-12

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法（IEC 60191-6-4-2003）；德文版EN 60191-6-4:2003

2004-01-01

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则；quat扁平包装（QFP）包装尺寸的测量方法（IEC 60191-6-3-2000）；德文版EN 60191-6-3:2000

2001-06-01

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 60191-6-21-2010）；德文版EN 60191-6-21:2010

2011-03-01