Environmental testing - Part 2-74: Tests - Test Xc: Fluid contamination
环境试验第2-74部分:试验试验Xc:液体污染

2018-04-25

Amendment 1 - Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth
修改件1.环境试验.第2-10部分:试验.试验J和指南:霉菌生长

2018-04-25

Amendment 1 - Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance
修改件1.环境试验.第2-64部分:试验.试验Fh:振动、宽带和随机指南

2019-10-09

Amendment 1 - Basic environmental testing procedures - Part 2-45: Tests - Test XA and guidance: Immersion in cleaning solvents
修改件1.基本环境试验程序.第2-45部分:试验.试验XA和指南:浸入清洗溶剂中

1993-02-15

Amendment 1 - Basic environmental testing procedures - Part 2-7: Tests - Test Ga and guidance: Acceleration, steady state
修改件1.基本环境试验程序.第2-7部分:试验.试验Ga和指南:稳态加速度

1986-06-01

Amendment 1 - Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
修改件1——环境试验——第2-67部分:试验——试验Cy:主要用于部件的湿热、稳态、加速试验

2019-07-02

Optics and photonics — Environmental test methods — Part 2: Cold, heat and humidity — Amendment 1
光学和光子学环境试验方法第2部分:冷、热和湿修改件1

2023-07-28

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
修改件1.环境试验.第2-69部分:试验.试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2019-06-19

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
修改件1.环境试验.第2-58部分:试验.试验Td:表面安装器件（SMD）的可焊性、耐金属化溶解性和耐焊接热的试验方法

2017-07-28

Refrigerating systems and heat pumps — Safety and environmental requirements — Part 2: Design, construction, testing, marking and documentation — Amendment 1
制冷系统和热泵.安全和环境要求.第2部分:设计、建造、试验、标记和文件.修改件1

2020-06-22