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Technology Assessment Handbook on Multilayer Boards 多层板技术评估手册
这本手册有800多页,包含70多篇关于多层技术的最佳文章。主题包括:性能、设计、材料、加工、氧化物、层压、孔制备和评估。
Over 800 pages, this handbook contains more than 70 of the best articles published on multilayer technology. Topics include: Performance, Design, Materials, Processing, Oxides, Lamination, Hole Preparation, and Evaluations.
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
IPC TA-720
Technology Assessment Handbook on Laminates
层压板技术评估手册
现行
IPC TA-722
Technology Assessment Handbook on Soldering
焊接技术评估手册
现行
IPC TA-723
Technology Assessment Handbook on Surface Mounting
表面安装技术评估手册
现行
BS 123300-2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
质量评估体系 分规范 刚性多层印制板
2001-12-17
现行
BS 123300-003-2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
质量评估体系 能力详细说明 刚性多层印制板
2001-12-17
现行
GOST 23661-1979
Платы печатные многослойные. Требования к типовому технологическому процессу прессования
多层印刷电路板 对标准技术压制过程的要求
现行
BS 123800-2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
质量评估体系 分规范 具有贯穿连接的挠性多层印制板
2001-12-17
现行
BS EN 123300-1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
电子元件质量评定协调体系规范 分规范 多层印制板
1989-08-31
现行
BS CECC 23300-003-1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
电子元件质量评定协调体系 能力详细规范:多层印制板
1996-04-15
现行
BS 123600-2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 分规范 带贯穿连接的软硬多层印制板
2001-12-17
现行
BS 123800-003-2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板
2001-12-17
现行
BS 123600-003-2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的软硬多层印制板
2001-12-17
现行
BS EN 123800-1997
Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 具有贯穿连接的挠性多层印制板
1997-05-15
现行
BS EN 123600-1997
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 带贯穿连接的软硬多层印制板
1997-05-15
现行
BS CECC 23800-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性多层印制板
1998-06-15
现行
BS CECC 23600-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性-刚性多层印制板
1998-06-15
现行
ISO 23734-2021
Marine technology — Marine environment impact assessment (MEIA) — On-board bioassay to monitor seawater quality using delayed fluorescence of microalga
海洋技术.海洋环境影响评价(MEIA).用微藻延迟荧光监测海水质量的船上生物测定
2021-07-27
现行
BS ISO 23734-2021
Marine technology. Marine environment impact assessment (MEIA). On-board bioassay to monitor seawater quality using delayed fluorescence of microalga
海洋技术 海洋环境影响评估(MEIA) 利用微藻延迟荧光监测海水质量的船上生物测定
2021-08-02