现行

KS C 6458(2017 Confirm)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
预浸料多层印刷线路板（环氧树脂浸渍玻璃布）

1997-08-19

现行

KS C 6458(2022 Confirm)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
多层印刷线路板用预浸料（环氧树脂浸渍玻璃布）

1997-08-19

现行

SJ/T 11050-2014

多层印制板用环氧玻纤布粘结片预浸料
Prepreg used as bonding sheet for multilayer printed boards-Epoxy resin-impregnated glass cloth

2014-10-14

现行

JIS C 6523-1995

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth
多层印制线路板用预浸料改性或未改性聚酰亚胺树脂浸渍玻璃布

1995-01-01

现行

JIS C 6524-1995

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
多层印制线路板用预浸料双马来酰亚胺/三嗪/环氧树脂浸渍玻璃布

1995-01-01

现行

SJ/T 11481-2014

多层印制板用氰酸酯改性环氧玻纤布粘结片预浸料
Prepreg used as bonding sheets for multilayer printed boards-Cyanate ester modified epoxy resin-impregnated glass cloth

2014-10-14

现行

MIL MIL-S-13949/16B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材AF（编织芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/16A）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/23B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/23A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材BF（非织造芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/23A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/16B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/16B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/11B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GE（编织E-玻璃增强、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1994-06-06

现行

MIL MIL-S-13949/11B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GE（编织电子玻璃增强材料、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GM（编织E-玻璃增强、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1993-04-11

现行

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GM（编织电子玻璃增强材料、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/12B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GF（编织E-玻璃增强、多数双功能环氧树脂、阻燃）（替代MIL-S-13949/12A）（无S/S文件）

1993-08-16

现行

MIL MIL-S-13949/12B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃）（取代MIL-S-13949/12A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/18A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GH（编织电子玻璃增强材料、多数多功能环氧树脂、热强度保持性、阻燃性）（取代MIL-S-13949/18）（无文件）

1997-08-01

现行

MIL MIL-S-13949/18A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GH（编织电子玻璃增强材料、多数多功能环氧树脂、热强度保持性、阻燃性）（取代MIL-S-13949/18）（无文件）

1998-11-30

现行

MIL MIL-S-13949/18A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GH（编织E玻璃增强、多数多功能环氧树脂、热强度保持、阻燃）（替代MIL-S-13949/18）（无S/S文件）

1993-08-06