Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters
半导体器件 第16-9部分:微波集成电路 移相器

2024-10-09

Draft Document - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 47E/374/CD:2008)
文件草案.半导体器件.第16-5部分:微波集成电路.振荡器（IEC 47E/374/CD:2008）

2009-03-01

Draft Document - Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English
文件草案-半导体器件-第16-7部分:微波集成电路-衰减器（IEC 47E/734/CD:2020）；英文文本

2021-07-01

Draft Document - Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 47E/735/CD:2020); Text in English
文件草案-半导体器件-第16-8部分:微波集成电路-限制器（IEC 47E/735/CD:2020）；英文文本

2021-07-01

Draft Document - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors (IEC 47E/265/CD:2004)
文件草案.半导体器件.分立器件.第4部分:微波二极管和晶体管（IEC 47E/265/CD:2004）

2005-01-01

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
文件草稿.半导体器件.微机电器件.第9部分:MEMS用晶片间键合强度测量（IEC 47/1947/CD:2007）

2008-03-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
文件草案.半导体器件的机械标准化.第6-16部分:BGA LGA FBGA和FLGA用半导体试验和老化插座术语表（IEC 47D/835/CD:2013）

2013-08-01

Draft Document - Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers (IEC 86C/1102/CD:2013)
文件草案.光纤有源元件和器件.性能标准.第9部分:种子反射半导体光放大器收发器（IEC 86C/1102/CD:2013）

2013-04-01