This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type？1 and type？2 fluxes, as specified in ISO？9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO？9453).

This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.