切割和磨削是广泛使用的工艺，旨在去除不需要的材料，并引入所需的几何形状和表面特性。虽然人们经常认为研磨只是用小切屑进行切割，但没有什么比这更离谱了。借助适当的模型讨论了切削和磨削之间的主要区别。由于到目前为止，温度是切削和磨削过程中最重要的因变量，因此应特别注意此变量。本文旨在促进人们更好地理解磨削过程中所涉及的内容，从而解决新材料、新工艺或新要求在实践中遇到的异常问题。

CUTTING AND GRINDING ARE WIDELY USED PROCESSES DESIGNED TO REMOVE UNWANTED MATERIAL AND TO INTRODUCE DESIRED GEOMETRY AND SURFACE PROPERTIES. WHILE IT IS OFTEN SUGGESTED THAT GRINDING IS MERELY CUTTING WITH SMALL CHIPS, NOTHING COULD BE FURTHER FROM THE TRUTH. THE MAJOR DIFFERENCES BETWEEN CUTTING AND GRINDING ARE DISCUSSED WITH THE AID OF APPROPRIATE MODELS. SINCE TEMPERATURE IS BY FAR THE MOST IMPORTANT DEPENDENT VARIABLE IN CUTTING AND GRINDING, PARTICULAR ATTENTION IS GIVEN TO THIS VARIABLE. THIS PAPER PROMOTES A BETTER UNDERSTANDING OF WHAT IS INVOLVED IN GRINDING SO UNUSUAL PROBLEMS MET IN PRACTICE WITH NEW MATERIALS, PROCESSES OR REQUIREMENTS MAY BE SOLVED.