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现行 IEC 60317-21:2013+AMD1:2019 CSV
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Specifications for particular types of winding wires - Part 21: Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 155 特种绕组线规范第21部分:155级聚酰胺包覆的可焊聚氨酯漆包圆铜线
发布日期: 2019-06-12
IEC 60317-21:20 13+A1:2019规定了双涂层155级可焊接漆包圆铜绕组线的要求。底层涂层基于聚氨酯树脂,只要其保留原始树脂的化学特性并满足所有规定的电线要求,就可以对其进行改性。叠加涂层基于聚酰胺树脂。 注-改性树脂是经过化学变化的树脂,或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本标准涵盖的公称导体直径范围为: -1级:0,050 mm至1,600 mm并包括1,600 mm; -2级:0,050毫米至1,600毫米(含1,600毫米)。IEC 60317-0-1:20 13第4条规定了标称导体直径。本第三版取消并取代1990年出版的第二版,修正案1:1997和修正案2:19 99。本版构成技术修订版。与上一版相比,此版本包括以下重大技术变更: -新的3.2.2载有关于绕组线的一般说明,以前是范围的一部分; -修订IEC 60317-0-1:20 13的参考文献,以阐明其应用是规范性的; -合并17.1和17.2的可焊性要求; -对条款19的修改,介电耗散系数; -新订的第23条,针孔测试。 该合并版本由第三版(2013年)及其修正案1(2019年)组成。因此,除本出版物外,无需下令修订。 关键词:可焊漆包圆铜绕组线要求,155级,双涂层
IEC 60317-21:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin.
NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1: 0,050 mm up to and including 1,600 mm;
- Grade 2: 0,050 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- modification to Clause 19, Dielectric dissipation factor;
- new Clause 23, Pin hole test.
This consolidated version consists of the third edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
Keywords: requirements of solderable enamelled round copper winding wire, class 155, dual coating
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归口单位: TC 55
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