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现行 HG/T 4617-2014
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酯化树脂催化剂 Ester resin catalyst
发布日期: 2014-05-06
实施日期: 2014-10-01
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关联关系
研制信息
相似标准/计划/法规
现行
SAE AMS3296B
Diglycidyl Ester Resin
二缩水甘油酯树脂
1993-07-01
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HG/T 5876-2021
环氧乙烯基酯树脂
Epoxy vinyl ester resin
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HG/T 5404-2018
烯烃聚合催化剂中邻苯二甲酸酯的测定 气相色谱法
Test method of phíhalate esters in polyilefin catalyst-C as chromatograp hy
2018-10-22
现行
MIL MIL-R-24719
RESINS, VINYL ESTER, LOW PRESSURE LAMINATING
树脂 乙烯基酯 低压层压
1989-05-04
现行
ASM P-29
DERAKANE 411-45 - Vinyl Ester Resin
DERAKANE 411-45-乙烯基酯树脂
1991-08-01
现行
GB/T 50590-2010
乙烯基酯树脂防腐蚀工程技术规范(附条文说明)
Technical code for anticorrosion engineering of vinyl ester resins
2010-05-31
现行
JIS K 6940-1998
Glass flakes vinyl ester resin lining films
玻璃鳞片乙烯基酯树脂衬里膜
1998-01-01
现行
ASM P-31
DERAKANE 8084 - Elastomer Modified Vinyl Ester Resin
DERAKANE 8084-弹性体改性乙烯基酯树脂
1991-11-01
现行
GB/T 42790-2023
丙烯酸共聚聚氯乙烯树脂
Acrylic ester / vinyl chloride graft co-polymer resin
2023-08-06
现行
ASM P-35
DERAKANE 510A - Epoxy Vinyl Ester Resin Without Additives
DERAKANE 510A-不含添加剂的环氧乙烯基酯树脂
1992-06-01
现行
GB/T 5548-2007
树脂整理剂 加催化剂后溶液稳定性的测定
Resin finishing agent—Determination of the stability of solution after adding catalyst
2007-11-28
现行
ASM P-12
DERAKANE 470-36 and 470-45 - Thermosetting Vinyl Ester Resins
DERAKANE 470-36和470-45-热固性乙烯基酯树脂
1989-11-01
现行
BS 2782-4-METHOD 433A-1979
Methods of testing plastics. Chemical properties-Determination of inorganic chlorine in epoxide resins and glycidyl esters
塑料的试验方法 化学性质 环氧树脂和缩水甘油酯中无机氯的测定
1979-06-29
现行
CJ/T 218-2010
给水用丙烯酸共聚聚氯乙烯管材及管件
Pipe and fittings of acrylic ester/vinyl chloride graft co-polymer resin for water supply
2010-03-15
现行
SJ/T 11481-2014
多层印制板用氰酸酯改性环氧玻纤布粘结片预浸料
Prepreg used as bonding sheets for multilayer printed boards-Cyanate ester modified epoxy resin-impregnated glass cloth
2014-10-14
现行
MIL MIL-S-13949/30A
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/30) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GC(编织E玻璃增强、多数氰酸酯树脂、阻燃)(替代MIL-S-13949/30)(无S/S文件)
1993-05-18
现行
MIL MIL-S-13949/28A
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/28) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材SC(编织S-2玻璃纤维1/增强、多数氰酸酯树脂、阻燃)(替代MIL-S-13949/28)(无S/S文件)
1993-05-18
现行
MIL MIL-S-13949/29A
SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
基材GC层压印刷线路板(编织E玻璃增强 多数氰酸酯树脂 阻燃 金属包覆或非包覆)(替代MIL-S-13949/29)(无S/S文件)
1993-05-18
现行
MIL MIL-S-13949/28A Notice 1-Inactivation
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL SC (WOVEN S-2 GLASS FIBER 1/ REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/28) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材SC(编织S-2玻璃纤维1/增强 多数氰酸酯树脂 阻燃)(取代MIL-S-13949/28)(无S/S文件)
1997-08-01
现行
MIL MIL-S-13949/29A Notice 1-Inactivation
SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GC(编织电子玻璃增强材料 多数氰酸酯树脂 阻燃 金属包覆或非包覆)(取代MIL-S-13949/29)(无S/S文件)
1997-08-01