现行

ECA/EIA IS 36

CHIP CAPACITORS, MULTI-LAYER (CERAMIC DIELECTRIC)
多层片式电容器（陶瓷介质）

1987-01-01

现行

YS/T 1338-2019

电容器电极镍粉
Nickel powder for capacitor electrode

2019-08-02

现行

ECA/EIA CB 11

GUIDELINES FOR THE SURFACE MOUNTING OF MULTILAYER CERAMIC CHIP CAPACITOR
多层陶瓷片式电容器表面安装指南

1986-08-01

现行

T/ZQBJXH 033-2023

片式多层陶瓷电容器 薄膜丝印机

2023-11-30

现行

ECA/IECQ QC 301901/US0002

FIXED MULTILAYER CERAMIC CHIP CAPACITORS SUBCLASS 1B
固定多层陶瓷片式电容器子类1B

1990-03-01

现行

GOST R 50296-1992

Конденсаторы постоянной емкости для электронной аппаратуры. Часть 10. Групповые технические условия на многослойные керамические конденсаторы - чипы постоянной емкости
用于电子设备的固定电容器 部分规格:固定多层陶瓷片式电容器

现行

ECA/IECQ QC 301901/US0001

FIXED MULTILAYER CERAMIC CHIP CAPACITORS - SUBCLASS 2R1
固定多层陶瓷片式电容器.第2R1子类

1990-03-01

现行

EIA 198-3-10

Multilayer (Monolithic), Uunencapsulated, Ceramic Dielectric, Surface-Mount Low Inductance Chip Capacitors and Multi-Terminal Low Inductance Capacitors
多层（单片）、封装、陶瓷介质、表面贴装低电感片式电容器和多端低电感电容器

2015-08-01

现行

GOST R 50297-1992

Конденсаторы постоянной емкости для электронной аппаратуры. Часть 10. Форма технических условий на многослойные керамические конденсаторы - чипы постоянной емкости. Уровень качества Е
用于电子设备的固定电容器 部分规格:固定多层陶瓷片式电容器 评估等级

现行

ECA/IECQ QC 301901/US0005

FIXED MULTILAYER CERAMIC CHIP CAPACITORS SUBCLASS 1B ASSESSMENT LEVEL E
固定多层陶瓷片式电容器子类1B评估等级E

1991-03-01

现行

JIS C 5101-10-1999

Fixed capacitors for use in electronic equipment Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors
电子设备用固定电容器第10部分:分规范:多层陶瓷片式固定电容器

1999-01-01

现行

ECA/IECQ QC 301901/US0006

FIXED MULTILAYER CERAMIC CHIP CAPACITORS SUBCLASS 2R1 ASSESSMENT LEVEL E
固定多层陶瓷片式电容器子类2R1评估等级E

1991-03-01

现行

DIN 45910-19

Harmonized system of quality assessment for electronic components; sectional specification: fixed multilayer ceramic chip capacitors
电子元件质量评定协调体系；分规范:多层陶瓷片式固定电容器

1991-02-01

现行

JIS C 5101-10-1-1999

Fixed capacitors for use in electronic equipment -- Part 10: Blank detail specification: Fixed multilayer ceramic chip capacitors Assessment level E
电子设备用固定电容器第10部分:空白详细规范:多层陶瓷片式固定电容器评定水平E

1999-01-01

现行

UNE 20543-10-1984

FIXED CAPACITORS: PART 10: SECTIONAL SPECIFICATION: FIXED MULTILAYER CERAMIC CHIP CAPACITORS. SELECTION OF METHODS OF TEST AND GENERAL REQUIREMENTS
固定电容器:第10部分:分规范:多层陶瓷片式固定电容器 试验方法的选择和一般要求

1984-12-15

现行

DOD DOD-C-55681/11

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR35 METRIC
已确立可靠性的陶瓷介质多层固定无封装片式电容器CDR35公制

1983-08-25

现行

MIL MIL-PRF-55681G

Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
片式多层固定陶瓷电介质电容器 既有可靠性和非既有可靠性 通用规范

2016-07-12

现行

QPL QPL-55681-121

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-55681-120)
陶瓷介质多层固定片式电容器 既有可靠性和非既有可靠性 通用规范（代替QPL-55681-120）

2006-03-30

现行

DOD DOD-C-55681/9

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR33 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR33公制（无S/S文件）

1983-08-25

现行

DOD DOD-C-55681/8

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR32 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR32公制（无S/S文件）

1983-08-25