Draft Document - Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English
草案文件.模附材料的耐久性试验方法.第5部分:模块型电力电子器件用模附材料(系统焊接互连)的温度循环试验方法(IEC 91/1770/CD:2021);德语和英语文本