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现行 IEC 63215-2:2023
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Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices 压模连接材料的耐久性试验方法.第2部分:用于分立型功率电子器件的压模连接物质的温度循环试验方法
发布日期: 2023-10-24
IEC 63215-2:20 23适用于应用于分立型电力电子器件的管芯附着材料和连接系统。 本文件规定了考虑分立型电力电子器件实际使用条件的温度循环试验方法,以评估芯片连接接头材料和连接系统的可靠性,并建立了连接可靠性的分类等级(可靠性性能指标)。 本文档中规定的测试方法并非用于评估功率半导体器件本身。 本文件中规定的测试方法不被视为用于保证功率半导体器件封装可靠性的方法。 笔记?使用本文件获得的测试结果将不用作绝对定量数据,而是用于与使用相同设置的其他管芯附着材料结果进行相互比较。
IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices.
This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages.
NOTE?The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.
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归口单位: TC 91
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