Semiconductor devices. Semiconductor interface for human body communication-Characterization of interfacing performances
半导体器件 用于人体通讯的半导体接口

2016-06-30

Semiconductor devices. Semiconductor interface for human body communication-Capsule endoscope
半导体器件 用于人体通讯的半导体接口

2020-07-17

Semiconductor devices. Semiconductor interface for human body communication-General requirements
半导体器件 用于人体通讯的半导体接口

2016-06-30

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
半导体器件 - 用于人体通信的半导体接口 - 第2部分:接口性能的表征

2016-02-18

Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
半导体器件.人体通信用半导体接口.第4部分:胶囊内窥镜

2020-02-07

Semiconductor devices. Semiconductor interface for human body communication-Functional type and its operational conditions
半导体器件 用于人体通讯的半导体接口

2016-06-30

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
半导体器件人体通信用半导体接口第3部分:功能类型及其操作条件

2016-04-26

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (IEC 62779-2:2016); German version EN 62779-2:2016
半导体器件.人体通信用半导体接口.第2部分:接口性能的表征（IEC 62779-2-2016）；德文版EN 62779-2:2016

2017-01-01

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (IEC 62779-1:2016); German version EN 62779-1:2016
半导体器件.人体通信用半导体接口.第1部分:一般要求（IEC 62779-1-2016）；德文版EN 62779-1:2016

2017-01-01

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016); German version EN 62779-3:2016
半导体器件.人体通信用半导体接口.第3部分:功能类型及其操作条件（IEC 62779-3-2016）；德文版EN 62779-3:2016

2017-03-01

Semiconductor devices. Mechanical and climatic test methods-Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
半导体器件 机械和气候试验方法 静电放电（ESD）灵敏度测试 人体模型（HBM）

2018-04-30

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
半导体器件 - 机械和气候试验方法 - 第26部分:静电放电（ESD）灵敏度测试 - 人体模型（HBM）

2018-01-15

半导体器件 机械和气候试验方法 第26部分：静电放电（ESD）敏感度测试 人体模型（HBM）
Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM）

2023-09-07

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge sensitivity testing - Human body model (HBM) - Component Level (IEC 47/2101A/CDV:2011)
文件草案.半导体器件.机械和气候试验方法.第26部分:静电放电敏感性试验.人体模型（HBM）.部件级（IEC 47/2101A/CDV:2011）

2011-09-01

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2018); German version EN IEC 60749-26:2018
半导体器件.机械和气候试验方法.第26部分:静电放电（ESD）灵敏度试验.人体模型（HBM）（IEC 60749-26-2018）；德文版EN IEC 60749-26:2018

2018-10-01