本文件旨在供交付电子元件的原始元件制造商和作为平台系统集成商的原始设备制造商使用。它旨在在OCMs交付之前使用，可供OEM系统工程师和采购活动以及美国政府国防部系统工程师、采购活动和维修中心使用。本标准规定了仪器、技术、标准和方法，用于量化锡铅（Sn/Pb）合金中的铅（Pb）含量，以及使用X- 射线荧光（XRF）设备。

This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engineers, procuring activities and repair centers. This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn/Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment.