现行

SJ 20642-1997

半导体光电模块总规范
Semiconductor opto-electronic module General specification for

1997-06-17

现行

SJ 20642/3-1998

半导体光电模块 GD83型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD83 PIN-FET opto-receiver module

1998-03-11

现行

SJ 20642/2-1998

半导体光电模块 GD82型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD82 PIN-FET opto-receiver module

1998-03-11

现行

SJ 20642/1-1998

半导体光电模块GD81型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD81 PIN-FET opto-receiver module

1998-03-11

现行

GB/T 35437-2017

星载光电跟踪成像系统通用规范
General specification for spaceborne opto-electronic tracking and imaging system

2017-12-29

现行

GB/T 12667-2012

同步电动机半导体励磁装置总技术条件
General specification for excitation assembly with semiconductors for synchronous motors

2012-06-29

现行

GB/T 12669-2012

半导体变流串级调速装置总技术条件
General specification for cascade speed control assembly with semiconductor converter

2012-06-29

现行

BS CECC 50000-1987

Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices
电子元件质量评定协调体系 总规范:分立半导体器件

1987-10-30

现行

BS EN IEC 61191-1-2018

Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件

2018-11-13

现行

BS EN 150001-1993

Specification for harmonized system of quality assessment for electronic components. Blank detail specification: general purpose semiconductor diodes
电子元件质量评定协调体系规范 空白详细规范:通用半导体二极管

1981-03-15

现行

BS EN 120000-1996

Harmonized system of quality assessment for electronic components. General specification: semiconductor optoelectronic and liquid crystal devices
电子元件质量评定协调体系 总规范:半导体光电和液晶器件

1996-09-15

现行

SJ/T 10079-1991

半导体集成电路CT54182/CT74182型超前进位产生器
Detail specification for electronic components--Semiconductor integrated circuits--CT54182/CT74182 look-ahead carry generator

1991-04-08

现行

KS C IEC 61191-1(2016 Confirm)

인쇄기판 조립품－제1부：품목규격：표면실장 및 관련 조립기술을 이용하여 납땜된 전기전자 조립품에 대한 요구사항
印制板组件第1部分:总规范采用表面安装和相关组装技术的焊接电气和电子组件的要求

2006-12-18

现行

KS C IEC 61191-1

인쇄회로기판 조립품 —제1부: 일반규격 — 표면실장 및 관련 실장기술을 이용하여 솔더링한 전기전자 조립품에 대한 요구사항
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

2021-10-19

现行

IEC 61191-1-2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

2018-09-14

现行

IEC 61191-1-2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

2018-09-14

现行

GB/T 19247.1-2003

印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

2003-07-02

现行

BS EN 153000-1998

Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
电子元件质量评定协调体系 总规范:离散压力接触功率半导体器件（资格认证）

1998-07-15

现行

BS 11/30255124 DC

BS EN 61191-1. Printed board assemblies. Part 1. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
BS EN 61191-1 印制板组件 第一部分 通用规范 使用表面安装和相关组装技术的焊接电气和电子组件的要求

2011-11-01

现行

DIN EN IEC 61191-1

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求（IEC 61191-1-2018）；德文版EN IEC 61191-1:2018

2019-06-01