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现行 HG/T 4590-2014
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塔填料表面润湿性能测定方法 Test method for surface wettability of tower packing
发布日期: 2014-05-12
实施日期: 2014-10-01
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件.机械和气候试验方法.第20-1部分:对湿气和焊接热的综合影响敏感的表面安装器件的搬运 包装 标签和装运
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IEC 60749-20-1-2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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GB/T 4937.201-2018
半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
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Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
文件草案——半导体器件——机械和气候试验方法——第20-1部分:对湿气和焊接热的综合影响敏感的表面安装器件的搬运、包装、标签和装运(IEC 47/2488/CDV:2018);德文版和英文版prEN IEC 60749-20-1:2018
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