Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
电气材料、印制板和其他互连结构和组件的试验方法.互连结构材料的试验方法 柔性电介质材料回弹强度和回弹强度保持系数的测定
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.