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Capability detail specification: flexible printed boards without through connections; german version EN 123400-800:1992 能力详细规范:无贯穿连接的柔性印制板;德文版EN 123400-800:1992
发布日期: 1992-11-01
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发布单位或类别: 德国-德国标准化学会
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相似标准/计划/法规
现行
BS EN 123400-800-1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
电子元件质量评定协调体系 能力详细规范:无贯穿连接的柔性印制板
1991-12-20
现行
BS CECC 123400-003-1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
电子元件质量评定协调体系规范 能力详细规范:无贯穿连接的柔性印制板
1994-02-15
现行
BS 123400-003-2001
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
质量评估体系 能力详细说明 无贯穿连接的柔性单面和双面印制板
2001-12-17
现行
BS 123800-003-2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板
2001-12-17
现行
BS EN 123500-800-1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的柔性印制板
1991-12-20
现行
DIN EN 123500-800
Capability detail specification: flexible printed boards with through connections; german version EN 123500-800:1992
能力详细规范:带贯穿连接的柔性印制板;德文版EN 123500-800:1992
1992-11-01
现行
BS CECC 123500-003-1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
电子元件质量评定协调体系规范 能力详细规范:带贯穿连接的柔性印制板
1994-02-15
现行
BS 123500-003-2001
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的柔性单面和双面印制板
2001-12-17
现行
BS CECC 23800-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性多层印制板
1998-06-15
现行
BS 96/213355 DC
IEC 2326-2-1. Printed boards. Part 2. Rigid single and double sided printed boards without interlayer connections. Section 1. Capability detail specification. Performance level A, B and C. 52/674/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-2-1 印制板 第二部分 无夹层连接的刚性单面和双面印制板 第一节 能力详细说明 A、B和C级性能52/674/CD 能力详细规范-性能等级A、B和C
1996-10-15