现行

BS 123800-003-2001

System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板

2001-12-17

现行

BS EN 123500-800-1992

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的柔性印制板

1991-12-20

现行

BS CECC 123500-003-1994

Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
电子元件质量评定协调体系规范 能力详细规范:带贯穿连接的柔性印制板

1994-02-15

现行

BS EN 123400-800-1992

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
电子元件质量评定协调体系 能力详细规范:无贯穿连接的柔性印制板

1991-12-20

现行

DIN EN 123400-800

Capability detail specification: flexible printed boards without through connections; german version EN 123400-800:1992
能力详细规范:无贯穿连接的柔性印制板；德文版EN 123400-800:1992

1992-11-01

现行

BS 123500-003-2001

System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的柔性单面和双面印制板

2001-12-17

现行

BS CECC 23800-801-1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性多层印制板

1998-06-15

现行

BS CECC 123400-003-1994

Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
电子元件质量评定协调体系规范 能力详细规范:无贯穿连接的柔性印制板

1994-02-15

现行

BS 123400-003-2001

System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
质量评估体系 能力详细说明 无贯穿连接的柔性单面和双面印制板

2001-12-17

现行

BS 123600-003-2001

System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的软硬多层印制板

2001-12-17

现行

GB/T 18334-2001

有贯穿连接的挠性多层印制板规范
Specification for flexible multilayer printed boards with through conections

2001-03-07

现行

UNE 20621-8-1985

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
印制板 带贯穿连接的单面和双面柔性印制板规范

1985-12-15

现行

BS 6221-9-1991

Printed wiring boards-Specification for flexible multilayer boards with through connections
印刷线路板 带贯穿连接的挠性多层板规范

1991-09-30

现行

BS 123700-003-2001

System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的挠性刚性双面印制板

2001-12-17

现行

BS 123200-003-2001

System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
质量评估体系 能力详细说明 带电镀通孔的刚性双面印制板

2001-12-17

现行

UNE 20621-7-1985

PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
印制板 无贯穿连接的单面和双面柔性印制板规范

1985-10-15

现行

BS 123300-003-2001

System of quality assessment. Capability detail specification. Rigid multilayer printed boards
质量评估体系 能力详细说明 刚性多层印制板

2001-12-17

现行

BS CECC 23600-801-1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性-刚性多层印制板

1998-06-15

现行

BS EN 62326-4-1-1997

Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification-Capability detail specification. Performance levels, A, B and C
印制板 带有夹层连接的刚性多层印制板 分规范 能力详细说明 绩效等级A、B和C

1997-06-15

现行

BS CECC 23700-801-1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
电子元件质量评定协调体系 性能详细规范:带贯穿连接的挠性-刚性双面印制板

1998-06-15