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Requirements for solder paste for high-quality interconnections in electronics assembly

2015-05-15

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
电子组装附件材料 - 第1-2部分:电子组装中高质量互连焊锡膏的要求

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Method for chemical analysis of lead-free solder-The inductively coupled plasma atom emission spectrometry method

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Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
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2005-01-01

Draft Document - Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
文件草稿.环境试验.第2-83部分:试验.试验Tf:用无铅焊膏润湿平衡法对表面安装器件（SMD）用电子元件的可焊性试验（IEC 91/682/CD:2007）

2007-09-01

BS EN 60068-2-83. Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste
英国标准EN 60068-2-83 环境测试 第2-83部分 测验 测试Tf 用无铅焊膏润湿平衡法测试表面贴装器件（SMD）用电子元件的可焊性

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