现行

SAE ARP 1332C

Wave Soldering Procedure
波峰焊接程序

2007-02-01

现行

SAE ARP1332D

Wave Soldering Procedure (Stabilized: Aug 2013)
波峰焊程序（稳定:2013年8月）

2013-08-12

现行

EIA 364-71

Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets
电连接器和插座的焊料芯吸（波焊技术）试验程序

2008-05-01

现行

ECA SP 5148

SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
电连接器和插座的焊料芯吸（波焊技术）试验程序

2007-02-05

现行

SME EE00-140

Parylene Conformal Coating Compatibility Evaluation With No-Clean Solder Pastes, Wave Solder Fluxes And Flux Cored Wire Solders
Parylene保形涂层与无清洁锡膏、波形焊剂和药芯焊丝焊料的相容性评估

2000-11-01

现行

IPC 7530A

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
大规模焊接工艺（回流焊和波峰焊）的温度分布指南

2017-02-28

现行

IPC TR-460A

Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
波峰焊印制电路板故障排除清单

1984-02-01

现行

DIN EN 14612

Space product assurance - Verification and approval of automatic machine wave soldering
航天产品保证——自动波峰焊的验证和批准；德文版EN 14612:2003

2004-05-01

现行

BS EN 62739-3-2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Selection guidance of erosion test methods
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法

2017-04-30

现行

IPC J-STD-005A

Requirements for Soldering Pastes
锡膏的要求

2012-02-01

现行

IEC 62739-3-2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
使用熔融无铅焊料合金的波峰焊设备腐蚀试验方法第3部分:腐蚀试验方法的选择指南

2017-01-06

现行

BS EN 62739-2-2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Erosion test method for metal materials with surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法

2016-10-31

现行

SJ 21374-2018

高可靠行波管慢波组件夹持工艺控制要求
Process control requirements for slow-wave component clamping of high reliability traveling-wave-tube

2018-01-18

现行

IPC 7527

Requirements for Solder Paste Printing
锡膏印刷要求

2012-05-01

现行

NHB 5300.4(3A-1)

Requirements for Soldered Electrical Connections
焊接电气连接的要求

1992-01-01

现行

NASA NHB 5300.4(3A-2)

Requirements for Soldered Electrical Connections
焊接电气连接的要求

1992-01-01

现行

BS EN 62739-1-2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Erosion test method for metal materials without surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法

2013-09-30

现行

IPC J-STD-006B

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
电子焊接用电子级焊料合金、助焊剂和非助焊剂的要求

2006-01-01

现行

IEC 62739-2-2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
使用熔融无铅钎料合金的波峰焊接设备的腐蚀试验方法 - 第2部分:表面处理金属材料的腐蚀试验方法

2016-07-13

现行

GB/T 36999-2018

海洋波浪能电站环境条件要求
Requirements on environmental conditions of wave energy power station

2018-12-28