现行

MIL MIL-P-47005 Notice 1-Validation

PASTE, COLOR CONCENTRATE, EPOXY RESIN BASE (NO S/S DOCUMENT)
糊剂 颜料浓度 环氧树脂基（无S/S文件）

1990-09-06

现行

MIL MIL-P-47005 Notice 2-Cancellation

PASTE, COLOR CONCENTRATE, EPOXY RESIN BASE (NO S/S DOCUMENT)
环氧树脂基色浆（无S/S文件）

1996-01-30

现行

MIL MIL-R-47004

RESIN, EPOXY BASE, THIXOTROPIC (NO S/S DOCUMENT)
触变环氧基树脂（无S/S文件）

1974-04-19

现行

MIL MIL-R-47004 Notice 1-Validation

RESIN, EPOXY BASE, THIXOTROPIC (NO S/S DOCUMENT)
树脂 环氧基 二氧化硫（NO S/S文件）

1990-09-05

现行

CID A-A-3053

ADHESIVE, EPOXY RESIN BASE, GENERAL PURPOSE (SUPERSEDING MMM-A-187) (NO S/S DOCUMENT)
通用环氧树脂基胶粘剂（替代MMM-A-187）（无S/S文件）

1996-08-06

现行

QPL QPL-18177-105 Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS FIBER BASE, EPOXY-RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-18177-104)
玻璃纤维基环氧树脂热固性层压塑料板（无S/S文件）（代替QPL-18177-104）

1992-04-16

现行

MIL MIL-S-13949/16B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材AF（编织芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/16A）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/23B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/23A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材BF（非织造芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/23A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/16B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/16B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/11B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GE（编织E-玻璃增强、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1994-06-06

现行

MIL MIL-S-13949/22B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
基材BF层压印刷线路板（非纺织芳纶增强、环氧树脂、金属包覆或非包覆）（替代MIL-S-13949/22A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/11B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GE（编织电子玻璃增强材料、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/22B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/22B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GM（编织E-玻璃增强、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1993-04-11

现行

MIL MIL-S-13949/25B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
基材CF层压印刷线路板板材（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/25A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GM（编织电子玻璃增强材料、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/25B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
层压印刷线路板薄板 基材CF（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（取代MIL-S-13949/25A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/15C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
基材AF层压印刷线路板（编织芳纶增强、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/15B）（无S/S文件）

1993-03-28