Wall and floor tiling-Design and installation of ceramic and mosaic tiling in specific conditions. Code of practice
墙面和地板瓷砖

2015-10-31

Ceramic tiles. Grouts and adhesives-Requirements, test methods, evaluation of conformity, classification and designation for waterproof membranes used with the installation of ceramic tiles
瓷砖 灌浆和粘合剂

2020-11-05

Wall and floor tiling-Design and installation of internal and external ceramic and mosaic floor tiling in normal conditions. Code of practice
墙面和地板瓷砖

2014-11-30

Ceramic tiles — Grouts and adhesives — Part 6: Requirements, test methods, evaluation of conformity, classification and designation for waterproof membranes used with the installation of ceramic tiles
瓷砖.灌浆和粘合剂.第6部分:瓷砖安装用防水膜的要求、试验方法、合格评定、分类和名称

2020-11-04

Wall and floor tiling-Design and installation of external ceramic, natural stone and mosaic wall tiling in normal conditions. Code of practice
墙面和地板瓷砖

2015-04-30

Wall and floor tiling-Design and installation of ceramic, natural stone and mosaic wall tiling in normal internal conditions. Code of practice
墙壁和地板瓷砖 在正常内部条件下设计和安装陶瓷、天然石材和马赛克墙面瓷砖 业务守则

2018-06-29

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-16

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 - 第6-8部分:表面贴装半导体器件封装外形图的一般规则 - 玻璃密封陶瓷四方扁平封装（g-qfp）设计指南

2001-08-27

Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
半导体器件的机械标准化第6-8部分:表面安装半导体器件封装外形图绘制的一般规则玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南

2002-06-28

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则；玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南（IEC 60191-6-8-2001）；德文版EN 60191-6-8:2001

2002-05-01