现行

BS EN 60191-3-2000

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化 集成电路外形图绘制通则

2000-06-15

现行

IEC 60191-1-2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则

2018-01-23

现行

IEC 60191-6-2009

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则

2009-11-26

现行

BS EN 60191-6-10-2003

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Dimensions of P-VSON
半导体器件的机械标准化

2004-03-31

现行

IEC 60191-3-1999

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化.第3部分:集成电路外形图编制的一般规则

1999-10-29

现行

SJ/Z 9021.3-1987

半导体器件的机械标准化 第３部分：集成电路外形图绘制总则
Mechanical standardization of semiconductor devices--Part 3: General rules for the preparation of outline drawings of integrated circuits

1987-09-14

现行

UNE-EN 60191-3-2001

Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
半导体器件机械标准化第3部分:集成电路外形图绘制通则

2001-01-31

现行

BS IEC 60191-2-1966+A21-2020

Mechanical standardization of semiconductor devices-Dimensions
半导体器件的机械标准化

2020-04-02

现行

BS EN 60191-6-18-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化

2010-10-31

现行

BS EN 60191-6-1-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2002-03-29

现行

IEC 60191-6-10-2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸

2003-11-19

现行

UNE-EN 60191-6-10-2004

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸

2004-05-28

现行

BS EN 60191-6-5-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-15

现行

SJ/Z 9021.1-1987

半导体器件的机械标准化 第１部分：半导体器件图形绘制
Mechanical standardization of semiconductor devices--Part 1: Preparation of drawings of semiconductor devices

1987-09-14

现行

BS 05/30129010 DC

IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版 半导体器件的机械标准化 第一部分 分立器件外形图绘制通则

2005-02-09

现行

BS EN 60191-6-12-2011

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化

2011-08-31

现行

BS EN 60191-6-21-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化

2010-12-31

现行

BS EN 60191-6-4-2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-08-04

现行

BS EN 60749-1-2003

Semiconductor devices. Mechanical and climatic test methods-General
半导体器件 机械和气候试验方法

2003-07-07

现行

IEC 60191-6-18-2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南

2010-01-07