Information technology—Sensor networks—Part 301:Communication and information exchange: Network layer and application support sublayer technical specifications for low-rate wireless sensor networks
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature