TEST PROCEDURE FOR SEMICONDUCTOR THERMAL DISSIPATING DEVICES
半导体散热器件的试验程序

1971-05-01

Semiconductor devices. Flexible and stretchable semiconductor devices-Test method for thermal characteristics of flexible materials
半导体器件 柔性可伸缩半导体器件

2019-03-05

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
半导体器件.柔性和可伸展半导体器件.第5部分:柔性材料热特性的试验方法

2019-02-27

INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
集成电路热测量方法电气试验方法（单半导体器件）

1995-12-01

INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
集成电路热测量方法电气试验方法（单半导体器件）

1995-12-01

Fibre optic interconnecting devices and passive components. Basic test and measurement procedures-Tests. Thermal shocks
光纤互连设备和无源元件 基本测试和测量程序

2016-09-30

TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
重离子辐照半导体器件中单粒子效应管理的试验程序

1996-12-01

TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
重离子辐照半导体器件中单粒子效应管理的试验程序

1996-12-01

Semiconductor devices. Micro-electromechanical devices-Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
半导体器件 微机电设备

2013-10-31

INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
测量单通道热流半导体器件结-壳热阻的接口试验方法

2010-11-01

INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
测量单通道热流半导体器件结-壳热阻的接口试验方法

2010-11-01

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
半导体器件 - 微机电器件 - 第11部分:用于微机电系统的自由立体材料的线性热膨胀系数的测试方法

2013-07-17

BS EN 62047-11. Semiconductor devices. Micro-electromechanical devices. Part 11. Test method for linear thermal expansion coefficients of MEMS materials
英国标准EN 62047-11 半导体器件 微型机电设备 第11部分 MEMS材料线性热膨胀系数的试验方法

2010-03-11

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks
光纤互连器件和被动元件 - 基本测试和测量程序 - 第2-47部分:测试 - 热冲击

2016-05-19

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
文件草稿.半导体器件.微机电器件.第11部分:MEMS材料线性热膨胀系数的试验方法（IEC 47F/49/CD:2010）

2010-06-01

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-47: Tests - Thermal shocks (IEC 61300-2-47:2006).
纤维光学互连器件和无源元件.基本试验和测量程序.第2-47部分:试验.热冲击（IEC 61300-2-47-2006）

2007-06-27

Draft Document - Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks (IEC 86B/2791/CD:2008)
文件草案.光纤互连器件和无源元件.基本试验和测量程序.第2-47部分:试验.热冲击（IEC 86B/2791/CD:2008）

2009-02-01

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
半导体器件.微机电器件.第11部分:微机电系统用独立材料线性热膨胀系数的试验方法（IEC 62047-11-2013）；德文版EN 62047-11:2013

2014-04-01