KS T 1319-2012(2022)-防腐包装方法通则-国家数字标准馆

现行 KS T 1319-2012(2022)

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방청 포장 방법 통칙 防腐包装方法通则

发布日期： 2012-12-05

该标准规定了在运输或保管以钢铁为主的金属材料及金属制品（以下简称金属制品）时，为防止生锈而采取的旁听包装方法及试验方法。

이 표준은 철강을 주로 한 금속 재료 및 금속 제품(이하, 금속 제품이라 한다.)을 수송 또는 보관할때에 녹의 발생을 막기 위하여 하는 방청 포장 방법 및 시험방법에 대하여 규정한다.

分类信息

发布单位或类别：韩国-韩国标准

ICS分类： 55.020货物的包装和调运 - 货物的包装和调运综合

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半导体器件的机械标准化

IEC 60191-6-21-2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法

BS EN 60191-6-4-2003

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IEC 60191-6-20-2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法

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BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化第6-21部分表面安装半导体器件封装外形图绘制的一般规则小外形包装的包装尺寸测量方法（SOP）

IEC 60191-6-4-2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法

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Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

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BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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Draft Document - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
文件草案.半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 47D/733/CD:2008）

DIN IEC 60191-6-20-DRAFT

Draft Document - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
文件草案.半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）的封装尺寸测量方法（IEC 47D/732/CD:2008）

DIN EN 60191-6-21

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小型封装外形尺寸的测量方法（SOP）（IEC 60191-6-21-2010）；德文版EN 60191-6-21:2010

DIN EN 60191-6-20

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）封装尺寸的测量方法（IEC 60191-6-20-2010）；德文版EN 60191-6-2

DIN EN 60191-6-4

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法（IEC 60191-6-4-2003）；德文版EN 60191-6-4:2003

DIN EN 60191-6-3

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则；quat扁平包装（QFP）包装尺寸的测量方法（IEC 60191-6-3-2000）；德文版EN 60191-6-3:2000

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