Methods for test for determination of properties of cushioning materials for package design purposes
包装设计用缓冲材料性能测定的试验方法

1992-01-31

방청 포장 방법 통칙
通则防腐防锈包装方式

2012-12-05

방청 포장 방법 통칙
防腐包装方法通则

2012-12-05

General rule for rust preventive packaging method
防锈包装方法通则

2009-01-01

Единая система конструкторской документации. Правила выполнения пакета данных для передачи электронных конструкторских документов. Общие положения
统一的设计文件系统 传输电子文件的数据包制作规则 一般原则

2011-05-12

Упаковка. Доступная конструкция. Легкое открывание. Общие требования и методы испытания
包装 无障碍设计 易于打开 一般要求和试验方法

Дороги автомобильные общего пользования. Ограждения дорожные фронтальные, удерживающие боковые комбинированные и удерживающие пешеходные. Общие технические требования. Методы испытаний и контроля. Правила применения
一般用途的汽车道路 防撞垫、混合障碍物和行人约束障碍物 一般技术要求 试验和控制方法 适用规则

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化

2010-12-31

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化

2010-12-31

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法

2010-08-30

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化

2010-10-31

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2002-03-29

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-08-04

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法

2010-08-30

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-03-04

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-15

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
半导体器件的机械标准化

2011-08-31

BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化 第6-21部分 表面安装半导体器件封装外形图绘制的一般规则 小外形包装的包装尺寸测量方法（SOP）

2008-12-01

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法

2003-06-11

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化 - 第6-3部分:表面贴装半导体器件封装外形图的一般规则 - 四方扁平封装的封装尺寸测量方法（qfp）

2000-09-29