IEC TS 62647-4:2018（E）定义了在航空航天、国防和高可靠性产品的电子元件管理计划（ECMP）背景下，更换球栅阵列（BGA）元件封装上锡球的要求。本文件的目的是向再造球公司（以下简称再造球供应商）提供将纳入现有流程的管理和技术要求，或用于建立、实施和维护一套新流程或创建独立的再造球流程。

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.