BS PD IEC/TS 62647-4:2018是一项技术规范，规定了以下要求: 更换球栅阵列（BGA）组件封装上的焊球 航空航天、国防和高可靠性电子元件管理计划（ECMP） 产品。交叉引用:IEC 62668IEC TR 61340-5-2JEDEC JESD625IPC J-STD-004IPC-TM-650编号2.3.25ECA/IPC/JEDEC J-STD-075JEDEC JESD22-B117IPC J-STD-005IPC/JEDEC J-STD-020IPC/JEDEC J-STD-033JEDEC JESD22-B107AEC-Q100-010ANSI/ESD S20。20IEC 62090IPC J-STD-002JEDEC JESD22-B101IPC J-STD-001xSIPC J-STD-001MIL-STD-883IPC/JEDEC J-STD-035SAE AS5553JEDEC JESD213JESD22-A101IEC 61340-5-1JEDEC J-STD-046IEC TS 62647-21: 2013IEC TS 62668-1:2016IEC TS 62647-2:2012IEC TS 62647-22:2013IEC TS 62647-3:2014EIA-STD-4899ISO/IEC 17050-1MIL-PRF-38535IEC TS 62647-23IEC 62647IPC-7711/7721IDEA-STD-1010JEDEC JESD22-B112MIL-PRF-19500JEDEC JESD22-A104AS/EN/JISQ 9100MIL-PRF-38534IEC TS 62239-1IPC-TM-650-650编号2.3.28IEC TS 62668-JESD22-082EC可随时购买购买本文件。

BS PD IEC/TS 62647-4:2018, which is a Technical Specification, defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products.Cross References:IEC 62668IEC TR 61340-5-2JEDEC JESD625IPC J-STD-004IPC-TM-650 number 2.3.25ECA/IPC/JEDEC J-STD-075JEDEC JESD22-B117IPC J-STD-005IPC/JEDEC J-STD-020IPC/JEDEC J-STD-033JEDEC JESD22-B107AEC-Q100-010ANSI/ESD S20.20IEC 62090IPC J-STD-002JEDEC JESD22-B101IPC J-STD-001xSIPC J-STD-001MIL-STD-883IPC/JEDEC J-STD-035SAE AS5553JEDEC JESD213JEDEC JESD22-A101IEC 61340-5-1JEDEC J-STD-046IEC TS 62647-21:2013IEC TS 62668-1:2016IEC TS 62647-2:2012IEC TS 62647-22:2013IEC TS 62647-3:2014EIA-STD-4899ISO/IEC 17050-1MIL-PRF-38535IEC TS 62647-23IEC 62647IPC-7711/7721IDEA-STD-1010JEDEC JESD22-B112MIL-PRF-19500JEDEC JESD22-A104AS/EN/JISQ 9100MIL-PRF-38534IEC TS 62239-1IPC-TM-650 number 2.3.28IEC TS 62668-2IEC TS 62647-1JESD22-B108All current amendments available at time of purchase are included with the purchase of this document.