电气简图绘制规则 第7部分:总布置图
The drawing rules of electrical diagrams--Part 7:General arrangement diagram

2005-04-11

电气简图绘制规则 第5部分:接线图
The drawing rules of electrical diagrams--Part 5:Connection diagram

2005-04-11

电气简图绘制规则 第4部分:电路图
The drawing rules of electrical diagrams--Part 4:Circuit diagram

2005-04-11

电气简图绘制规则 第3部分:框图
The drawing rules of electrical diagrams--Part 3:Block diagram

2005-04-11

电气简图绘制规则 第6部分:线缆连接图
The drawing rules of electrical diagrams--Part 6:Cable connection diagram

2005-04-01

电气简图绘制规则 第1部分:术语和分类
The drawing rules of electrical diagram--Part 1:Terms and classification

2005-04-11

网络计划技术 第2部分：网络图画法的一般规定
Network planning techniques - Part 2: General rules for representation of network diagram

2009-05-06

철도 적용 — 철도차량 전기장치 — 제2부: 전기 구성품 — 일반 요구사항
铁路应用 - 车辆电气设备 - 第2部分:电工部件 - 一般规则

2019-03-14

Railway applications - Electric equipment for rolling stock - Part 2: Electrotechnical components - General rules
铁路应用机车车辆用电气设备第2部分:电工元件通则

2017-07-28

Railway applications - Electric equipment for rolling stock - Part 2: Electrotechnical components - General rules
铁路应用 - 车辆电气设备 - 第2部分:电工部件 - 一般规则

2017-07-28

Railway applications - Electric equipment for rolling stock -- Part 2: Electrotechnical components - General rules.
铁路设施.机车车辆用电气设备.第2部分:电工元件.一般规则

2002-11-25

轨道交通 机车车辆电气设备 第2部分：电工器件 通用规则
Railway applications—Electric equipment for rolling stock—Part 2:Electrotechnical components—General rules

2021-12-31

IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版 半导体器件的机械标准化 第一部分 分立器件外形图绘制通则

2005-02-09

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化.第6-2部分:表面安装半导体器件封装外形图绘制的一般规则.1,50mm、1,27mm和1,00mm节距球和柱端子封装的设计指南

2001-12-11

Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化第6-2部分:表面安装半导体器件封装外形图绘制的一般规则1.50mm、1.27mm和1.00mm节距球型和柱型端子封装的设计指南

2003-10-10

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1.50 mm, 1.27 mm and 1.00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
半导体器件的机械标准化.第6-2部分:表面安装半导体器件封装外形图绘制的一般规则；1.50 mm、1.27 mm和1.00 mm节距球型和柱型端子组件的设计指南（IEC 60191-6-2-2001）；德文版EN 60191-

2002-09-01