반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则

2006-11-30

반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则

2006-11-30

Semiconductor devices - Mechanical and climatic test methods - Part 1: General
半导体器件 - 机械和气候测试方法 - 第1部分:总则

2002-08-30

Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
半导体器件机械和气候试验方法第1部分:总则

2004-05-28

半导体器件 机械和气候试验方法 第1部分: 总则
Semiconductor devices―Mechanical and climatic test methods―Part 1: General

2006-08-23

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
修改件1.半导体器件.机械和气候试验方法.第19部分:模具剪切强度

2010-07-28

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
修改件1.半导体器件.机械和气候试验方法.第23部分:高温工作寿命

2011-01-27

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
修改件1.半导体器件.机械和气候试验方法.第27部分:静电放电（ESD）灵敏度试验.机器模型（MM）

2012-09-25

IEC 60749-38 ED.1. Semiconductor devices mechanical and climatic test methods. Part 38. Soft error rate testing of electronic components
IEC 60749-38第1版 半导体器件机械和气候试验方法 第38部分 电子元件的软错误率测试

2004-12-08

Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
半导体器件机械和气候试验方法第1部分:总则；德文版EN 60749-1:2003

2003-12-01

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件 - 机械和气候测试方法 - 第20-1部分:表面贴装装置的处理 包装 标签和运输对水分和焊接热的综合影响敏感

2019-06-26

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件.机械和气候试验方法.第20-1部分:对湿气和焊接热的综合影响敏感的表面安装器件的搬运 包装 标签和装运

2019-06-26

半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

2018-09-17

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
半导体器件机械和气候试验方法第22部分:粘结强度；德文版EN 60749-22:2003

2003-12-01

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003
半导体器件.机械和气候试验方法.第31部分:塑料封装器件（内部感应）的可燃性（IEC 60749-31-2002+Corr.1-2003）；德文版EN 60749-31:2003

2003-12-01

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
半导体器件机械和气候试验方法第8部分:密封；德文版EN 60749-8:2003

2003-12-01

Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
文件草案——半导体器件——机械和气候试验方法——第20-1部分:对湿气和焊接热的综合影响敏感的表面安装器件的搬运、包装、标签和装运（IEC 47/2488/CDV:2018）；德文版和英文版prEN IEC 60749-20-1:2018

2018-11-01