适用于薄膜集成电路和混合薄膜集成电路 无源和有源电路。也适用于部分完成的 F和HFIC也提供给客户进行后续处理 对于具有一个以上芯片的芯片载波电路，提供 它们通过电影互联互通 技术。 本规范规定了质量评估程序和程序 电气、气候、机械和耐久性试验方法 测验。它概述了应适用于本项目的要求 使用鉴定批准程序释放电路 或能力批准程序。

Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.