现行

GB/T 2423.101-2008

电工电子产品环境试验 第2部分：试验方法 试验：倾斜和摇摆
Environmental testing for electric and electronic products - Part 2: Test methods - Test: inclinations and swings

2008-05-20

现行

GB/T 2423.37-2006

电工电子产品环境试验 第2部分：试验方法 试验L：沙尘试验
Environmental testing for electric and electronic products - Part 2: Test methods - Test L：Dust and sand

2006-12-19

现行

GB/T 2423.15-2008

电工电子产品环境试验 第2部分: 试验方法 试验Ga和导则: 稳态加速度
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ga and guidance: Acceleration, steady

2008-03-24

现行

GB/T 20626.2-2018

特殊环境条件 高原电工电子产品 第2部分：选型和检验规范
Specific environmental condition—Electrical and electronic products for plateau—Part 2: Selective types and testing specification

2018-12-28

现行

GB/T 2423.57-2008

电工电子产品环境试验 第2-81部分: 试验方法 试验Ei: 冲击 冲击响应谱合成
Environmental testing for electric and electronic products - Part 2: Tests - Test Ei: Shock - Shock response spectrum synthesis

2008-05-19

现行

GB/T 2423.52-2003

电工电子产品环境试验 第2部分:试验方法 试验77:结构强度与撞击
Environmental testing for electric and electronic products--Part 2:Test methods--Test 77:Body strength and impact shock

2003-11-24

现行

KS C IEC 60068-2-69

환경시험 — 제2-69부: 시험 — Te/Tc 시험: 웨팅 밸런스(힘 측정)법에 의한 전자부품 및 회로기판의 땜질성 시험
环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2021-12-29

现行

GB/T 2423.32-2008

电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: Solderability test by the wetting balance method

2008-03-24

现行

GB/T 10593.2-2023

电工电子产品环境参数测量方法 第2部分：盐雾
Method of the measuring environmental parameters for electric and electronic products—Part 2: Salt mist

2023-08-06

现行

GB/T 2423.43-2008

电工电子产品环境试验　第2部分：试验方法　振动、冲击和类似动力学试验样品的安装
Environmental testing for electric and electronic products—Part 2:Test methods—Mounting of specimens for vibration, impact and similar dynamic tests

2008-05-19

现行

GB/T 2424.25-2000

电工电子产品环境试验 第3部分:试验导则 地震试验方法
Environmental testing for electric and electronic products--Part 3:Test guidance--Seismic test methods

2000-10-17

现行

IEC 60068-2-69-2017+AMD1-2019 CSV

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2019-06-19

现行

IEC 60068-2-69-2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
环境试验.第2-69部分:试验.试验Te/Tc:用润湿平衡（力测量）法对电子元件和印制板的可焊性试验

2017-03-07

现行

JIS C 60068-2-69-2019

Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

2019-01-01

现行

ISO 16750-2-2023

Road vehicles — Environmental conditions and testing for electrical and electronic equipment — Part 2: Electrical loads
道路车辆.电气和电子设备的环境条件和试验.第2部分:电气负载

2023-07-12

现行

GB/T 28046.2-2019

道路车辆 电气及电子设备的环境条件和试验 第2部分：电气负荷
Road vehicles—Environmental conditions and testing for electrical and electronic equipment—Part 2: Electrical loads

2019-10-18

现行

GB/T 5170.1-2016

电工电子产品环境试验设备检验方法 第1部分：总则
Inspection methods for environmental testing equipments for electric and electronic products—Part 1：General

2016-12-13

现行

GB/T 2423.4-2008

电工电子产品环境试验 第2部分：试验方法 试验Db： 交变湿热（12h＋12h循环）
Environmental testing for electric and electronic products - Part 2: Test method - Test Db: Damp heat，cyclic ( 12h+12h cycle)

2008-05-19

现行

GB/T 2423.53-2005

电工电子产品环境试验 第2部分:试验方法 试验Xb：由手的磨擦造成标记和印刷文字的磨损
Environmental testing for electric and electronic products-Part 2:Test methods-Test Xb:Abrasion of markings and letterings caused by rubbing of fingers and hands

2005-01-18

现行

BS 05/30139830 DC

IEC 60068-2-69 ED 2. Environmental testing. Part 2-69. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
IEC 60068-2-69第2版 环境测试 第2-69部分 测验 测试Te 用润湿平衡法测试表面贴装器件（SMD）用电子元件的可焊性

2005-10-04