现行

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷线路板 刚性 单层和双层 热固性树脂基材 带或不带电镀通孔 用于焊接部件安装

2020-03-02

现行

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带电镀孔 用于焊接部件安装

2009-07-04

现行

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2018-06-12

现行

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基材刚性单层和双层印刷线路板

2008-04-23

现行

MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
焊接零件安装用带或不带电镀通孔的热固性树脂基刚性单层和双层印刷线路板

2012-11-02

现行

BS 6221-5-1982

Printed wiring boards-Specification for single and double sided rigid printed boards with plated-through holes
印刷线路板 带电镀通孔的单面和双面刚性印制板规范

1982-01-29

现行

MIL MIL-PRF-31032/2A Amendment 1

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
印刷接线板 刚性 单层和双层 热固性树脂基材 带或不带孔 用于焊接部分安装（取代MIL-PRF-31032/2）

2006-02-24

现行

MIL MIL-PRF-31032/3D

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
挠性印刷线路板 单层和双层 带或不带电镀通孔 带或不带加强筋 用于焊接部件安装

2020-04-03

现行

MIL MIL-PRF-31032/3C Amendment 1

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋

2018-06-13

现行

MIL MIL-PRF-31032/3A Amendment 3

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-Through Holes, with or without Stiffeners for Soldered Part Mounting
软性印刷线路板 单层和双层 带或不带电镀通孔 有或不带焊接部件安装用加强件

2008-04-23

现行

MIL MIL-PRF-31032/3B Amendment 1(amendment incorporated)

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋

2012-11-03

现行

MIL MIL-PRF-31032/3A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Flexible, Single and Double Layer, with or without Plated-through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强筋

2009-06-10

现行

MIL MIL-PRF-31032/6C

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
印刷线路板 刚性 单面和双面 热塑性树脂基材 带或不带电镀通孔 用于高频应用

2020-05-06

现行

MIL MIL-PRF-31032/6 Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
高频应用用带或不带镀通孔的热塑性树脂基刚性单面和双面印刷线路板

2009-04-10

现行

MIL MIL-PRF-31032/3A Amendment 2

PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENERS FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/3)
单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强件 用于焊接部件安装（代替MIL-PRF-31032/3）

2006-10-31

现行

MIL MIL-PRF-31032/3A Amendment 1

PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENERS FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/3)
单层和双层柔性印刷线路板 带或不带镀通孔 带或无加强件 用于焊接部件安装（代替MIL-PRF-31032/3）

2006-02-24