表面安装技术　第1部分：表面安装元器件(SMDS)规范的标准方法
Surface mounting technology—Part 1:Standard method for the specification of surface mounting components(SMDs)

2003-11-24

표면실장기술 －제1부：표면실장부품(SMD)의 규격을 위한 표준방법
表面安装技术第1部分:表面安装元件规范的标准方法

2007-11-29

표면실장기술 －제1부：표면실장부품(SMD)의 규격을 위한 표준방법
表面安装技术－第1部分:表面安装元件（SMD）规范的标准方法

2007-11-29

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

2020-07-14

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
表面安装技术 第3部分:通孔回流（THR）焊接元件规范的标准方法

2021-02-03

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
表面贴装技术 - 表面贴装焊接接头的环境和耐久性试验方法 - 第1-3部分:循环滴落试验

2008-11-27

EN 62137-1-3. Surface-mount technology. Environmental and endurance test methods for surface mount solder joint. Part 1-3. Cyclic drop test
EN 62137-1-3 表面贴装技术 表面安装焊点的环境和耐久性试验方法 第1-3部分 循环跌落试验

2006-07-20

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009
表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-3部分:循环跌落试验（IEC 62137-1-3-2008）；德文版EN 62137-1-3:2009

2009-07-01

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
表面安装技术.第3-1部分:通孔回流焊（THR）组件规范的标准方法.使用焊膏表面印刷法的通孔直径设计指南

2022-06-17

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021
表面安装技术.第3部分:通孔回流焊（THR）用元件规范的标准方法（IEC 61760-3-2021）；德语版本EN IEC 61760-3:2021

2022-07-01

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化 - 第6-3部分:表面贴装半导体器件封装外形图的一般规则 - 四方扁平封装的封装尺寸测量方法（qfp）

2000-09-29

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则；quat扁平包装（QFP）包装尺寸的测量方法（IEC 60191-6-3-2000）；德文版EN 60191-6-3:2000

2001-06-01