表面安装技术　第1部分：表面安装元器件(SMDS)规范的标准方法
Surface mounting technology—Part 1:Standard method for the specification of surface mounting components(SMDs)

2003-11-24

표면실장기술 －제1부：표면실장부품(SMD)의 규격을 위한 표준방법
表面安装技术第1部分:表面安装元件规范的标准方法

2007-11-29

표면실장기술 －제1부：표면실장부품(SMD)의 규격을 위한 표준방법
表面安装技术－第1部分:表面安装元件（SMD）规范的标准方法

2007-11-29

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
表面贴装技术 - 第1部分:表面贴装元件（Smds）规范的标准方法

2020-07-14

Surface mounting technology-Standard method for the specification of surface mounting components (SMDs)
表面安装技术

2020-10-02

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
表面安装技术 第3部分:通孔回流（THR）焊接元件规范的标准方法

2021-02-03

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
表面贴装技术 - 表面贴装焊接接头的环境和耐久性试验方法 - 第1-3部分:循环滴落试验

2008-11-27

EN 62137-1-3. Surface-mount technology. Environmental and endurance test methods for surface mount solder joint. Part 1-3. Cyclic drop test
EN 62137-1-3 表面贴装技术 表面安装焊点的环境和耐久性试验方法 第1-3部分 循环跌落试验

2006-07-20

Surface mounting technology-Standard method for the specification of components for through-hole reflow (THR) soldering
表面安装技术

2021-03-18

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
表面安装技术.第3-1部分:通孔回流焊（THR）组件规范的标准方法.使用焊膏表面印刷法的通孔直径设计指南

2022-06-17

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009
表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-3部分:循环跌落试验（IEC 62137-1-3-2008）；德文版EN 62137-1-3:2009

2009-07-01

Vacuum technology — Standard methods for measuring vacuum pump performance — Part 3: Specific parameters for mechanical booster vacuum pumps
真空技术.真空泵性能测量的标准方法.第3部分:机械增压真空泵的特殊参数

2019-01-30

真空技术 真空泵性能测量标准方法 第3部分：机械增压泵的特定参数
Vacuum technology—Standard methods for measuring vacuum pump performance—Part 3: Specific parameters for mechanical booster vacuum pumps

2024-04-25

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化 - 第6-3部分:表面贴装半导体器件封装外形图的一般规则 - 四方扁平封装的封装尺寸测量方法（qfp）

2000-09-29

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
半导体器件的机械标准化.第6-3部分:表面安装半导体器件封装外形图绘制的一般规则；quat扁平包装（QFP）包装尺寸的测量方法（IEC 60191-6-3-2000）；德文版EN 60191-6-3:2000

2001-06-01

IEEE Standard for Information technology-- Local and metropolitan area networks-- Specific requirements-- Part 3: CSMA/CD Access Method and Physical Layer Specifications - Amendment 8: MAC Control Frame for Priority-based Flow Control
IEEE信息技术标准局域网和城域网特殊要求第3部分:CSMA/CD访问方法和物理层规范修改件8:基于优先级的流控制的MAC控制帧

2011-08-10

IEEE Standard for Information technology-- Local and metropolitan area networks-- Specific requirements-- Part 3: CSMA/CD Access Method and Physical Layer Specifications Amendment 6: Physical Layer and Management Parameters for Serial 40 Gb/s Ethernet Operation Over Single Mode Fiber
IEEE信息技术标准局域网和城域网具体要求第3部分:CSMA/CD访问方法和物理层规范修改件6:单模光纤上串行40Gb/s以太网操作的物理层和管理参数

2011-03-31

IEEE Standard for Information technology-- Local and metropolitan area networks-- Part 3: CSMA/CD Access Method and Physical Layer Specifications Amendment 7: Media Access Control (MAC) Service Interface and Management Parameters to Support Time Synchronization Protocols
IEEE信息技术标准局域网和城域网第3部分:CSMA/CD访问方法和物理层规范修改件7:支持时间同步协议的媒体访问控制（MAC）服务接口和管理参数

2011-07-15

IEEE Standard for Information technology-- Local and metropolitan area networks-- Specific requirements-- Part 3: CSMA/CD Access Method and Physical Layer Specifications Amendment 4: Media Access Control Parameters, Physical Layers, and Management Parameters for 40 Gb/s and 100 Gb/s Operation
IEEE信息技术标准局域网和城域网具体要求第3部分:CSMA/CD访问方法和物理层规范修改件4:40Gb/s和100Gb/s操作的媒体访问控制参数、物理层和管理参数

2010-06-22