Standard Test Method for Dilute Solution Viscosity of Ethylene Polymers
乙烯聚合物稀溶液粘度的标准试验方法

2018-05-01

Standard Test Method for Resin Solution Dilutability by Volumetric/Gravimetric Determination
通过体积/重量测定确定树脂溶液稀释度的标准测试方法

2020-06-01

Standard Test Method for Dilute Solution Viscosity of Vinyl Chloride Polymers
氯乙烯聚合物稀溶液粘度的标准试验方法

2022-05-01

Standard Test Method for Rubber—Determination of Gel, Swelling Index, and Dilute Solution Viscosity
橡胶的标准试验方法——凝胶、膨胀指数和稀溶液粘度的测定

2024-05-01

Standard Practice for Dilute-Solution Viscosity of Photodegradable Polystyrene/ Test Method for Tumbling Friability of Degradable Polystyrene Foams
可光降解聚苯乙烯稀溶液粘度的标准实施规程/可降解聚苯乙烯泡沫翻滚易碎性的试验方法

2000-05-03

洗涤用品常用试验方法 滴定分析（容量分析）用试验溶液的制备
Preparations of standard volumetric solutions of general test methods for washing products

2005-07-26

化妆品微生物标准检验方法 总则
Standard methods of microbiological examination for cosmetics--General rules

1987-05-28

Food microbiology, Method 11.1: Microbiology of the food chain - Preparation of test samples, initial suspension and decimal dilutions for microbiological examination - General rules for the preparation of the initial suspension and decimal dilutions (ISO 6887-1:2017, MOD)
食品微生物学 方法11.1:食物链微生物学-微生物检验用试样、初始悬浮液和十进制稀释液的制备-初始悬浮液和十进制稀释液制备的一般规则（ISO 6887-1-2017 MOD）

2018-11-14

General rules of testing methods for safety of medical electrical equipment (FOREIGN STANDARD)
医用电气设备安全性试验方法通则（国外标准）

1992-01-01

Microbiology of the food chain — Preparation of test samples, initial suspension and decimal dilutions for microbiological examination — Part 1: General rules for the preparation of the initial suspension and decimal dilutions — Amendment 1: Requirements and guidance on the use of a larger test portion size for qualitative methods
食品链微生物学——微生物检验用试验样品、初始悬浮液和十倍稀释液的制备——第1部分:初始悬浮液及十倍稀释溶液制备的一般规则——修正案1:定性方法中使用较大试验份数的要求和指导

2024-07-18

出口商品中农药、兽药残留量及生物毒素生物学检验方法标准编写的基本规定
General rules for drafting the standards of biological method for the determination of peaticide,veterinary drug residues and biotoxins in commodities for export

1996-07-10

SURFACE ACTIVE AGENTS. METHODS FOR PREPARATION, STANDARDIZATION AND STORAGE OF STANDARD SOLUTIONS TO BE USED IN VOLUMETRIC ANALYSIS OF SURFACE ACTIVE AGENTS AND FORMULATIONS CONTAINING THEM. PART 1: GENERALITIES.
表面活性剂 用于表面活性剂及其制剂容量分析的标准溶液的制备、标准化和储存方法 第一部分:概述

1994-04-24

Система стандартов безопасности труда. Цвета сигнальные, знаки безопасности и разметка сигнальная. Назначение и правила применения. Общие технические требования и характеристики. Методы испытаний
职业安全标准体系 安全颜色 安全标志和信号标记 用途和适用规则 一般技术要求和特点 测试方法

2015-12-10

Система стандартов безопасности труда. Средства индивидуальной защиты органов дыхания изолирующие дыхательные аппараты с химически связанным или сжатым кислородом. Технические требования. Методы испытаний. Маркировка. Правила отбора образцов
职业安全标准体系 个人防护呼吸装置 配有化学氧或压缩氧气 一般技术要求 测试方法 标记 抽样规则

2014-11-14

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化

2010-12-31

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-08-04

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化

2010-12-31

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法

2003-06-11

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
半导体器件的机械标准化 - 第6-3部分:表面贴装半导体器件封装外形图的一般规则 - 四方扁平封装的封装尺寸测量方法（qfp）

2000-09-29

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法

2010-08-30