IEC 62804的这一部分定义了测试和评估晶体硅光伏组件层压板（主要是具有一个或两个玻璃面的组件）中潜在诱导退化分层（PID-d）模式的程序。本文件评估了可归因于接地和模块单元电路之间电流传输的分层。本试验旨在驱动分层的因素包括与湿热暴露相关的附着力降低、界面处的钠积聚、电池电路中的阴极气体析出、金属化和光伏组件内由电压激活的其他组件 潜在的本范围不考虑与施加的应力因素（IEC TS 62804-1的权限）相关的晶体硅光伏组件功率变化。 交叉引用:IEC TS 61836IEC 61730-2IEC TS 62804-1IEC TS 62941IEC 60068-2-78:2012IEC 61215-2:2016IEC 61215-1:2016购买本文件时可用的所有现行修订均包含在购买本文件中。

This part of IEC 62804 defines procedures to test and evaluate for potential-induced degradation-delamination (PID-d) mode in the laminate of crystalline silicon PV modules— principally those with one or two glass faces. This document evaluates delamination attributable to current transfer between ground and the module cell circuit. Elements driving the delamination that this test is designed to actuate include reduced adhesion associated with damp heat exposure, sodium accumulation at interfaces, and cathodic gas evolution in the cell circuit, metallization, and other components within the PV module activated by the voltage potential. The change in power of crystalline silicon PV modules associated with the stress factors applied (the purview of IEC TS 62804-1) is not considered in the scope.Cross References:IEC TS 61836IEC 61730-2IEC TS 62804-1IEC TS 62941IEC 60068-2-78:2012IEC 61215-2:2016IEC 61215-1:2016All current amendments available at time of purchase are included with the purchase of this document.