现行

GB/T 41853-2022

半导体器件 微机电器件 晶圆间键合强度测量
Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement

2022-10-12

现行

IEC 62047-9-2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
半导体器件 - 微机电器件 - 第9部分:晶圆晶片接合强度测量

2011-07-13

现行

BS IEC 62047-34-2019

Semiconductor devices. Micro-electromechanical devices-Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件 微机电设备

2019-04-16

现行

BS 07/30172404 DC

BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS
英国标准EN 62047-9 半导体器件 微型机电设备 第九部分 MEMS晶片间键合强度的测量

2007-12-05

现行

IEC 62047-34-2019

Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件微机电器件第34部分:硅片上MEMS压阻压敏器件的试验方法

2019-04-05

现行

DIN IEC 62047-9-DRAFT

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
文件草稿.半导体器件.微机电器件.第9部分:MEMS用晶片间键合强度测量（IEC 47/1947/CD:2007）

2008-03-01

现行

DIN EN 62047-9

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
半导体器件.微机电器件.第9部分:MEMS用晶片间键合强度测量（IEC 62047-9-2011）；德文版EN 62047-9:2011

2012-03-01

现行

BS EN 62047-16-2015

Semiconductor devices. Micro-electromechanical devices-Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
半导体器件 微机电设备

2015-07-31

现行

BS EN 62047-20-2014

Semiconductor devices. Micro-electromechanical devices-Gyroscopes
半导体器件 微机电设备

2014-10-31

现行

BS EN 62047-1-2016

Semiconductor devices. Micro-electromechanical devices-Terms and definitions
半导体器件 微机电设备

2016-04-30

现行

BS EN 62047-19-2013

Semiconductor devices. Micro-electromechanical devices-Electronic compasses
半导体器件 微机电设备

2013-10-31

现行

IEC 62047-16-2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
半导体器件 - 微机电器件 - 第16部分:确定MEMS膜残余应力的测试方法 - 晶片曲率和悬臂梁偏转方法

2015-03-05

现行

BS IEC 62047-40-2021

Semiconductor devices. Micro-electromechanical devices-Test methods of micro-electromechanical inertial shock switch threshold
半导体器件 微机电设备

2021-09-14

现行

BS EN 62047-4-2010

Semiconductor devices. Micro-electromechanical devices-Generic specification for MEMS
半导体器件 微机电设备

2010-11-30

现行

BS EN 62047-5-2011

Semiconductor devices. Micro-electromechanical devices-RF MEMS switches
半导体器件 微机电设备

2013-04-30

现行

IEC 62047-20-2014

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪

2014-06-26

现行

GB/T 32817-2016

半导体器件 微机电器件 MEMS总规范
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS

2016-08-29

现行

BS EN 62047-10-2011

Semiconductor devices. Micro-electromechanical devices-Micro-pillar compression test for MEMS materials
半导体器件 微机电设备

2011-09-30

现行

BS IEC 62047-33-2019

Semiconductor devices. Micro-electromechanical devices-MEMS piezoresistive pressure-sensitive device
半导体器件 微机电设备

2019-04-18

现行

IEC 62047-1-2016

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
半导体器件 - 微机电器件 - 第1部分:术语和定义

2016-01-06