IEC 60749-3:20 17（E）旨在验证半导体器件的材料、设计、构造、标记和工艺是否符合适用的采购文件。外部目视检查是一种无损检测，适用于所有包装类型。该测试可用于确认、过程监控或批次验收。 与上一版相比，此版本包括以下重大技术变更: a)提及ESD保护的需要； b)包括关于锡晶须现象的信息； c)包括可选的报告表/清单。

IEC 60749-3:2017(E) is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.