Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
高密度互连（HDI）印制板的分段设计标准

2017-09-01

高密度互连印制板设计要求
Design requirements for high density interconnect printed circuit boards

2016-01-19

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
Buld Up/High Density Interconnect（HDI）印制电路板的术语和定义、试验方法和设计示例

2000-01-01

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Transfer adhesive films for flexible printed boards
互连结构材料 覆层和非覆层非增强基材分规范集（适用于柔性印制板）

1999-06-15

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范

2023-06-14

GENERAL SPECIFICATION FOR HIGH PERFORMANCE, HIGH DENSITY, TWO PIECE PRINTED CIRCUIT BOARD CONNECTOR (SUPERSEDING DESC 89065A)
高性能、高密度两件式印刷电路板连接器通用规范（取代DESC 89065A）

2003-10-01

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
印刷板和其他互连结构材料 - 第3-5部分:非增强基材 包层和包装（用于柔性印刷板）的分段规格 - 转印胶带

1999-02-10

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
印制板和其他互连结构用材料 第3-5部分:覆层和非覆层（用于柔性印制板）无加强基材分规范集 转移胶粘膜

2000-11-21

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
印制板和其他互连结构用材料.第3-4部分:包层和非包层（用于柔性印制板）无增强基材的分规范集.涂有粘合剂的柔性聚酰亚胺薄膜

1999-02-10

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
印制板和其他互连结构用材料.第3-3部分:包覆和非包覆（柔性印制板用）无增强基材的分规范集.涂粘合剂的柔性聚酯薄膜

1999-02-10

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
印制板和其他互连结构用材料 第3-4部分:覆层和非覆层（用于柔性印制板）无加强基材分规范集 胶粘剂涂覆柔性聚酰亚胺薄膜

2000-11-17

Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
印制板和其他互连结构用材料第3-3部分:覆层和非覆层（用于柔性印制板）非增强基材分规范集涂有粘合剂的柔性聚酯薄膜

2000-12-04

Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
印制板和其他互连结构用材料

2008-07-31

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料 包覆和未包覆的非增强基材分规范集（适用于柔性印制板） 涂有粘合剂的柔性聚酯薄膜 涂胶柔性聚酯薄膜

1999-06-15

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data applications-Sectional specification. Printed board connectors
直流、低频模拟和数字高速数据应用中使用的经质量评估的连接器

1997-03-15

인쇄 회로 기판 및 기타 전자 배선용 재료－제4-1부：무동박(다층 회로 기판 제조용)프리프레그 소재의 부분 표준－규정 난연 등급의 E-유리 섬유 직조 에폭시 프리프레그
印制板和其他互连结构用材料第4-1部分:非包覆预浸料分规范（多层板制造用）规定可燃性的环氧编织E玻璃预浸料

2012-11-19

인쇄 회로 기판 및 기타 전자 배선용 재료－제4-1부：무동박(다층 회로 기판 제조용)프리프레그 소재의 부분 표준－규정 난연 등급의 E-유리 섬유 직조 에폭시 프리프레그
印制板和其他互连结构用材料第4-1部分:无涂层预浸料材料分规范集（多层板制造用）规定可燃性的环氧编织E玻璃预浸料

2012-11-19

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
印刷电路板和其他互连结构用材料.第4-1部分:无涂层预浸料材料分规范集（多层板制造用）.规定可燃性的环氧编织E玻璃预浸料

2008-01-30

Draft Document - Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 91/1548/CD:2018); Text in German and English
文件草案——印制板和其他互连结构用材料——第6-3部分:增强材料分规范集——印制板用“E”玻璃编织成品织物规范（IEC 91/1548/CD:2018）；德语和英语文本

2019-04-01

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印刷电路板和其他互连结构材料第4-18部分:预浸料材料（用于制造多层板材）的分段规格 - 高性能环氧树脂编织的易燃易燃玻璃预浸料（垂直燃烧试验） 用于无铅部件

2013-11-04