本出版物旨在通过提供一种通用方法，确定在常规非循环电路板组装和测试操作期间可能发生的抗弯曲载荷断裂能力，来表征元件电路板级互连的断裂强度。本文件适用于使用传统回流焊技术连接到印刷线路板的表面安装组件，并补充了现有标准，这些标准解决了运输、搬运或现场操作期间的机械冲击或冲击问题。包括对第8.7节“测试板菊花链”的修订。

This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links.