深度包检测设备技术要求
Technical Requirements of Deep Packet Inspection Device

2009-06-15

基于分离架构的深度包检测系统技术要求 独立式流量采集设备
Technical requirements for deep packet inspection system based on separation architecture-Independent traffic collection device

2015-07-14

Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices-Test method for defects using optical inspection
半导体器件 功率器件用碳化硅同质外延片缺陷的无损识别准则

2019-02-08

无菌医疗器械包装试验方法　第11部分：目力检测医用包装密封完整性
Test methods for sterile medical device package—Part 11:Determining integrity of seals for medical packaging by visual inspection

2014-06-17

Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
半导体器件.功率器件用碳化硅同质外延片中缺陷的无损识别标准.第2部分:光学检验缺陷的试验方法

2019-01-30

半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection

2023-12-28

Liquid crystal display devices - Part 5-2: Environmental, endurance and mechanical test methods - Visual inspection of active matrix colour liquid crystal display modules (IEC 61747-5-2:2011); German version EN 61747-5-2:2011
液晶显示器件.第5-2部分:环境、耐久性和机械试验方法.有源矩阵彩色液晶显示模块的目视检查（IEC 61747-5-2-2011）；德文版EN 61747-5-2:2011

2012-01-01