DV系统可以改善封闭环境中的空气质量，但不能消除高冷负荷。另一方面，PCB系统可以消除高冷负荷，节省能源，但需要与通风系统一起使用。因此，本研究项目的主要目标是系统地评估耦合DV-PCB系统的整体性能，并为其设计和操作制定指南。制定的指南应能为工程师提供设计DV-PCB系统的分步程序，该系统能够满足热和通风需求，且不会在PCB线圈上产生冷凝风险。引文:ASHRAE研究

DV system can improve air quality in enclosedenvironment but cannot remove high cooling load. On the other hand, PCB systemcan remove high cooling load and save energy but needs to be used with aventilation system. Therefore, the major objective of this research project wasto systematically evaluate the overall performance of the coupled DV-PCBsystem, and to develop a guide for its design and operation. The developedguideline should be able to provide engineers with a step-by-step procedure fordesigning a DV-PCB system that can meet thermal and ventilation needs withoutrisk of condensation on PCB coils.