现行

IPC 5702

Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
原始设备制造商确定未填充印制板清洁度可接受水平的指南

2007-06-01

现行

SJ 21097-2016

印制板清洁度测试方法及要求
Test methods and requirements of cleanliness for printed circuit boards

2016-01-19

现行

IPC 5703

Cleanliness Guidelines for Printed Board Fabricators
印制板制造商的清洁指南

2013-05-01

现行

BS PD IEC TR 61191-7-2020

Printed board assemblies-Technical cleanliness of components and printed board assemblies
印制板组件

2020-03-23

现行

IEC TR 61191-7-2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
印制板组件.第7部分:组件和印制板组件的技术清洁度

2020-03-11

现行

GB/T 43059-2023

印制板及印制板组装件的平整度控制要求
Requirements of flatness control for printed boards and printed board assemblies

2023-09-07

现行

IPC D-325A

Documentation Requirements for Printed Boards
印制板的文件要求

1995-05-01

现行

QJ 3103A-2011

印制电路板设计要求
Design requirement for printed circuit board

2011-07-19

现行

GOST R 55693-2013

Платы печатные жесткие. Технические требования
刚性印刷板 技术要求

现行

GOST R 51039-1997

Платы печатные. Требования к восстановлению и ремонту
印刷板返修和修理的要求

现行

NASA NHB 5300.4(3K)

DESIGN REQUIREMENTS FOR RIGID PRINTED WIRING BOARD
刚性印刷线路板的设计要求

1986-01-01

现行

CB 20104-2012

水雷印制板表面组装要求
Requirements of surface mount for mine printed boards

2013-01-04

现行

QJ 1889A-2012

印制电路板显微剖切检验要求
Testing requirement for microsectioning of printed circuit board

2013-01-04

现行

QJ 1887A-2012

印制电路板照相底版技术要求
Technical requirement for artwork of printed circuit board

2013-01-04

现行

SJ/T 10565-1994

印制板组装件装联技术要求
Acceptability technical requirements of printed board assembly

1994-08-08

现行

GOST IEC 61188-1-2-2013

Печатные платы и печатные узлы. Проектирование и применение. Часть 1-2. Общие требования. Контролируемое волновое сопротивление
印刷板和印刷电路板组件 设计和使用 第1-2部分 通用要求 受控阻抗

2013-11-14

现行

SJ 21098-2016

印制板显微剖切方法及要求
Test methods and requirements of microsection for printed circuit boards

2016-01-19

现行

QJ 20172-2012

印制电路板电镀纯锡技术要求
Technical requirement for puretin plating of printed circuit board

2013-01-04

现行

QJ 3015A-2012

印制电路板图形转移工艺技术要求
Technical requirements for printed circuit board pattern transfer

2013-01-04

现行

QJ 2860A-2012

印制电路板孔金属化工艺技术要求
Technical requirement for hole metallization of printed circuit board

2013-01-04