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现行 MIL MIL-STD-868A Notice 1-Validation
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NICKEL PLATING, LOW EMBRITTLEMENT, ELECTRODEPOSITION (SUPERSEDING MIL-STD-868)(S/S BY MIL-STD-868B) 镀镍 低脆 电沉积(取代MIL-STD-868)(S/S为MIL-STD-868B)
发布日期: 1986-03-24
分类信息
发布单位或类别: 美国-美国军事规范和标准
关联关系
研制信息
相似标准/计划/法规
现行
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现行
MIL MIL-STD-868B
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MIL MIL-STD-870B Notice 1-Inactivation
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1996-12-09
现行
MIL MIL-STD-1501C Notice 2-Inactivation
CHROMIUM PLATING, LOW EMBRITTLEMENT, ELECTRODEPOSITION (SUPERSEDING MIL-STD-1501B) (S/S BY MIL-STD-1501D)
镀铬 低脆化 电沉积(取代MIL-STD-1501B)
1996-12-09
现行
MIL MIL-STD-1500B Notice 1-Inactivation
CADMIUM-TITANIUM PLATING, LOW EMBRITTLEMENT, ELECTRODEPOSITION (SUPERSEDING MIL-STD-1500A)(S/S BY MIL-STD-1500C)
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1996-12-09
现行
MIL MIL-STD-870C
CADMIUM PLATING, LOW EMBRITTLEMENT, ELECTRODEPOSITON(SUPERSEDING MIL-STD-870B)
电沉积低脆镉镀层(取代MIL-STD-870B)
2007-02-23
现行
MIL MIL-STD-1501F
CHROMIUM PLATING, LOW EMBRITTLEMENT, ELECTRO-DEPOSITION(SUPERSEDING MIL-STD-1501E)
电沉积低脆镀铬(取代MIL-STD-1501E)
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现行
MIL MIL-P-47184A Notice 1-Cancellation
PLATING, NICKEL-TUNGSTEN, ELECTRODEPOSIT ON ALUMINUM ALLOYS, BY SELECTIVE (BRUSH) METHOD (NO S/S DOCUMENT) (SUPERSEDING MIL-P-47184)
用选择性(刷)法在铝合金上电沉积镍钨镀层(无S/S文件)(代替MIL-P-47184)
1995-11-03
现行
MIL MIL-P-47184A
PLATING, NICKEL-TUNGSTEN, ELECTRODEPOSIT ON ALUMINUM ALLOYS, BY SELECTIVE (BRUSH) METHOD (NO S/S DOCUMENT) (SUPERSEDING MIL-P-47184)
用选择性(刷)法在铝合金上电沉积镍钨镀层(无S/S文件)(代替MIL-P-47184)
1990-12-12
现行
FED QQ-N-290A
NICKEL PLATING (ELECTRODEPOSITED) (SUPERSEDING QQ-N-290 AND MIL-P-6859) (S/S BY SAE-AMS-QQ-N-290)
镀镍(电沉积)(取代QQ-N-290和MIL-P-6859)(S/S由SAE-AMS-QQ-N-290提供)
1971-11-12
现行
FED QQ-N-290A
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1971-11-12
现行
MIL MIL-C-22226A
COPPER NICKEL MANGANESE ALLOY BARS, PLATES, AND SHEETS, LOW MAGNETIC EFFECT (FOR SPECIAL PURPOSE TOOLS AND EQUIPMENT) (SUPERSEDING MIL-C-22226)
低磁效应铜镍锰合金棒材、板材和薄板(专用工具和设备)(替代MIL-C-22226)
1973-02-22