现行

IPC 6012E

Qualification and Performance Specification for Rigid Printed Boards
刚性印制板的鉴定和性能规范

2020-02-01

现行

IPC 6018D

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
高频（微波）印制板的鉴定和性能规范

2022-02-01

现行

IPC ML-960

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
多层印制板用大规模层压板的鉴定和性能规范

1994-07-01

现行

IPC 6017A

Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
包含嵌入式有源和无源电路的印制板的鉴定和性能规范

2021-08-01

现行

IPC TF-870

Qualifications and Performance of Polymer Thick Film Printed Boards
聚合物厚膜印制板的质量和性能

1987-01-01

现行

IPC CC-830C

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印刷线路组件用电绝缘化合物的鉴定和性能

2018-01-01

现行

BS PD IEC/PAS 61249-8-1-2014

Qualification and performance of electrical insulating compound for printed wiring assemblies
印刷线路组件用电绝缘化合物的鉴定和性能

2014-06-30

现行

IEC PAS 61249-8-1-2014

Qualification and performance of electrical insulating compound for printed wiring assemblies
印刷线路组件用电绝缘化合物的鉴定和性能

2014-06-10

现行

AWS B2.1/B2.1M-2014

Specification for Welding Procedure and Performance Qualification
焊接工艺和性能评定规范

2013-11-21

现行

AWS B2.2/B2.2M-2016

Specification for Brazing Procedure and Performance Qualification
钎焊工艺和性能鉴定规范

2016-08-05

现行

1A1W1S1 Archive Product 437

Specification for Welding Procedure and Performance Qualification
焊接工艺和性能评定规范

2013-11-21

现行

1A1W1S1 Archive Product 485

Specification for Brazing Procedure and Performance Qualification
钎焊工艺和性能鉴定规范

2016-08-05

现行

IPC 6011

Generic Performance Specification for Printed Boards
印制板通用性能规范

1996-07-01

现行

IPC CC-830B with Amendment 1

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes Amendment 1
印刷线路组件用电绝缘化合物的鉴定和性能.包括修改件1

2008-10-01

现行

SAE ARP6379

Processes for Application-Specific Qualification of Electrical, Electronic, and Electromechanical Parts and Sub-Assemblies for Use in Aerospace, Defense, and High Performance Systems
航空航天、国防和高性能系统用电气、电子和机电零件及子组件的应用特定鉴定程序

2016-11-18

现行

GB/T 39342-2020

宇航电子产品 印制电路板总规范
Aerospace electronic products—General specification for printed circuit board

2020-11-19

现行

IPC 6015

Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
有机多芯片模块安装和互连结构的鉴定和性能规范

1998-02-01

现行

IEC PAS 61249-8-5-2014

Qualification and performance specification of permanent solder mask and flexible cover materials
永久性焊接掩模和柔性覆盖材料的鉴定和性能规范

2014-06-10

现行

BS PD IEC/PAS 61249-8-5-2014

Qualification and performance specification of permanent solder mask and flexible cover materials
永久性焊接掩模和柔性覆盖材料的鉴定和性能规范

2014-06-30

现行

AWS B2.4-2012

Standard Welding Procedure Specification for Welding Procedure and Performance Qualification for Thermoplastics
热塑性塑料焊接工艺和性能评定的标准焊接工艺规范

2012-04-10