IPC-6012E规范涵盖了刚性印制板的鉴定和性能，包括单面、双面、带或不带电镀通孔、带或不带盲孔/埋孔的多层和金属芯板。它涉及最终光洁度和表面镀层要求、导体、孔/通孔、验收测试频率和质量一致性，以及电气、机械和环境要求。IPC-6012E包含了许多新的和扩展的要求，如背面钻孔结构、替代表面光洁度、铜包裹电镀、标记油墨、可焊性测试、电镀悬置、显微切片评估、热冲击和基于性能的微孔结构测试。 用于IPC-6011。取代IPC-6012D。

IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.