MIL-PRF-55110H规定了带有或不带有电镀通孔的刚性单面、双面和多层印刷线路板的性能和鉴定要求（见6.1）。通过使用两种产品保证方法之一（QPL或QPL/QML）来完成验证。适用的主图纸中规定了对特定预期用途敏感的详细要求、特定特性和其他规定。

MIL-PRF-55110H establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes (see 6.1). Verification is accomplished through the use of one of two methods of product assurance (QPL or QPL/QML). Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.